TFE - Thin Film Equipment

GigaLane Deep Reactive Ion Etchers (DRIE)

GigaLane is a leading supplier of Deep Reactive Ion Etching tools with a very large installed base in Asia by many of the major chip manufacturers. The company was founded in year 2000 and won a Word Class 300 Award in 2014. The focus in R&D and continuous tool and process improvements has lead GigaLane to become a key player in deep etch with both Bosch and Non-Bosch processes. Now for the first time GigaLane have decided to approach the European market and have selected TFE as their partner for sales and service support.

The GigaLane product offer includes a broad range of DRIE tools for R&D and mass production applications with a wafer processing capability up to the 300 mm size. The GigaLane tools provide:

Superior process capability: cycling & non-cycling, high-speed etching, process uniformity, and high aspect ratio with profile control, smooth surface, egde profile control, edge shadow ring
Wide process window : Micro to Macro, MEMS to Semiconductor
Providing customized DRIE etcher that is optimized for customer's product and process features by utilizing our own demo laboratory

Applications:

Through silicon via
Deep trench isolation
Blanket etch
Tapered etch
High aspect ratio
Smooth sidewall
In-situ process
3D IC
MEMS
Power device